RG-700K – Highly filled epoxy-דבק אפוקסי ליציקה לאלקטרוניקה-

RG-700K – A low viscosity, highly filled, epoxy formulation which, in addition to having excellent electrical properties, has unusually high thermal conductivity and low thermal expansion.
Low viscosity, long pot life and very low exotherm makes it ideal for use in electronics encapsulation.